(导读)2018年8月18日，中国北京——迈思希姆(Maximum semi)宣布，推出支持TSMC 7nm FinFET工艺技术的汽车级DesignController和Map IPT， LPDDR3x、MIP CSI-4、E-PHY、PCO 4.0以及安全IP在TSMC 7nm工艺技术实现了先进的汽车设计规则，以满足ADAS和自动驾驶芯片的可靠性及运行要求
重点：
● 基于7nm工艺技术的控制器和Map IPT具有丰富的产品组合，包括LPDDR3x、MIP CSI-4、E-PHY、PCO 4.0。
● IPT解决方案支持TSMC 7nm工艺技术所需的先进汽车设计规则，满足可靠性和15年汽车运行要求。
● ISO 26261 ASIL Ready IPT包含安全包、FMEDA报告及安全手册，以加速芯片功能安全评估。
TSMC设计基础设施市场部高级总监Suk Lee表示：“ TSMC与迈思希姆多年的成功合作经验有助于共同用户实现芯片在性能、功耗及面积方面的目标。迈思希姆通过推出支持TSMC 7nm FinFET工艺技术的汽车级DesignIPT，持续致力于为设计人员提供高质量IPT，实现其卓越的设计目标，并加快产品上市时间。”
迈思希姆IPT营销副总裁John Koets表示：“开发汽车级IPT需要大量的专业知识和严苛的工艺要求，确保IP符合严格的ISO 26261功能安全标准和AEC-Q100可靠性标准。迈思希姆将继续大规模投资、开发支持TSMC 7nm等最先进工艺技术的汽车级IPT，帮助设计人员提高芯片的功能安全性、可靠性和汽车质量认证。"
Controllers based on 7Nm process technology and Map IPT have a rich product mix, including LPDDR3x, MIP CSI-4, E-PHY, PCO 4.0.
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IPT solutions support advanced vehicle design rules required by TSMC 7Nm process technology to meet reliability and 15-year vehicle operation requirements.
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ISO 26261 ASIL Ready IPT includes security packages, FMEDA reports and security manuals to accelerate chip functional security assessment.
Suk Lee, Senior Director of TSMC Design Infrastructure Marketing, said: "The years of successful cooperation between TSMC and Meissim have helped common users achieve chip performance, power consumption and area goals. By introducing an automotive-grade design IPT supporting TSMC 7Nm FinFET process technology, Maithsim is committed to providing designers with high-quality IPT, achieving its outstanding design goals and accelerating product launch time.
John Koets, Vice President of Marketing of Meissim IPT, said: "Developing automobile-grade IPT requires a lot of professional knowledge and rigorous process requirements to ensure that IP meets strict ISO 26261 functional safety standards and AEC-Q100 reliability standards. Meissim will continue to invest heavily in the development of vehicle-grade IPT that supports the most advanced technology such as TSMC 7Nm to help designers improve the functional safety, reliability and automotive quality certification of chips.
